Intel releases first details of next Intel 4 process node

After AMD revealed details of its upcoming CPU manufacturing architecture last week, Intel took to the stage at the 2022 IEEE VLSI Symposium to share key details about its upcoming Intel 4 process node. The Redmond giant also released images of its unannounced Meteor Lake compute die at the event. Check out the details below now!

Intel 4 Process Node Details

Intel says the new Intel 4 or “I4” process nodes that will replace Intel 7 nodes will offer 21.5% higher frequencies while consuming the same amount of power compared to traditional Intel 7 nodes, or provide the same frequency. It claims to achieve 40% power savings . Its predecessor. The company also said it achieved a 2x improvement in area scaling with the new technology. This means the company was able to double the transistor density of its high-performance library.

These improvements are the result of Intel’s move to advanced EUV (extreme ultraviolet) lithography instead of using deep ultraviolet immersion lithography. Intel 4 is the first process node to use the new EUV lithography, replacing the deep ultraviolet immersion lithography used in the Intel 7 process node, previously known as 10mm Enhanced Super Fin (10ESF). Thanks to the I4 process node, users experience significant performance and power efficiency improvements.

It’s important to note here that Intel’s competitors such as AMD and TSMC are already using EUV lithography in their manufacturing processes. The Redmond giant had been putting off the idea of ​​using the same in its processors for the past few years, but it’s now clear that Pat Gelsinger’s aggressive push to achieve industry dominance Thanks to this, I am currently focusing my efforts on EUV. Intel 4 will be the first process node to fully adopt EUV lithography technology.

Meteor Lake processor details

Other than this, Intel also shared an image (attached below) of its Meteor Lake compute die with Intel 4 process nodes and 3D Foveros packaging technology. We’ve seen Foveros packaging technology used in the company’s Lakefield processors, but this is the first time Intel is expected to use this packaging technology for mass production.

Other details regarding the upcoming Meteor Lake processors are scarce at this time. However, similar to Alder Lake processors, the upcoming Meteor Lake CPUs are expected to feature an x86 hybrid architecture . There are 6 performance cores and 8 efficiency cores. According to Intel, Meteor Lake is on track to launch in 2023, but an exact release timeline has not been provided at this time.

That’s right, keep an eye out for details on Intel’s new manufacturing technology and Meteor Lake processors in the coming months. Also, let us know your thoughts on the same in the comments section below.